EFEM Platform

      • HIGHLIGHTS

      Our EFEM Platform offers ultra-clean, reliable performance for wafer handling.

      One to four+ FOUP or SMIF interfaces.

      High-precision wafer alignment capabilities and wafer flip option.

      3- and 4- axis robots available as a standard design.

      Mini-environment for contamination control as well as airborne molecular contamination filter options.

      Optimized for cost and contamination levels to meet ISO-class cleanroom needs.

      300, 200, 150 and 100 mm circular wafers (customizable to other materials, shapes and sizes).

      Adaptable to different wafer technologies including film-frame carrier strategies, taiko wafers, thin/thick wafers, bonded wafers, non-flat wafers or wafers with 3D structures, and glass wafers.

      A Complete Solution for Optimal Results

      Our EFEM Platform can act as a standard EFEM, or can be customized to suit your application’s cleanliness, handling technique, throughput, and form-factor requirements. From design to manufacturing, we offer units in varying complexity and precision and can integrate the needed hardware, software, vision, optics design, sub-micron metrology, environmental control and materials handling to fit your needs from single units to 4-wide.

      Get to Market Faster

      By having all the capabilities you need under one roof, delivering flawless products is significantly simplified. Our options include: 

      • A range of end effector technologies: Bernoulli, edge grip, or vacuum grip
      • ESD charge control options
      • Vacuum and low contamination integration capabilities
      • Configurable layout for process simplification and/or footprint/form factor optimization
      • High accuracy aligner systems to 10 µm accuracy
      • Experience with integrated vibration isolation

        CONTACT US

      Additional Features: Vision, Optical and A.I. Expertise

      Additionally, we offer optical and vision system design capabilities including barcode readers, optical character recognition (OCR), defect analysis and characterization, contamination detection and flatness measurement. Integration of additional sensor technology can be offered, as required. Our in-house predictive reliability analysis software allows for continuous system monitoring and response.

      Safety, Reliability and SEMI Compliance

      Our EFEM is a reliable platform with a high MTBF and solid performance. It meets CE and SEMI standards for hardware and software including S2, S8, E84, E87, E58.

      Customization Options and Features: 

       

      EFEM Platform

      Environmental
      • Mini-Environment for up to ISO Class 1 Operation
      • Temperature Control
      • Electrostatic Charge Reduction
      Wafer Handling
      • Wafer Size: 300, 200, 150, 100
      • Accommodates Various Thicknesses and Warped Wafers
      • Varying Substrate Materials (Glass, Silicon, Silicon Carbide, Germanium)
      • End Effectors or Various Gripping Technologies (Edge, Vacuum, Bernoulli)
      • Wafer Flipping
      • Special Wafers or Other Substrates (Reticles, Film Frame, Display, JEDEC Trays)
      • Industry Standard SMIF and FOUP Load Ports
      • Accommodates Special Modules such as High-Precision Aligners
      Robotics
      • Single and Dual Arm
      • 3-Axis and 4-Axis

      Vision & Optical
      • Barcode Readers
      • Fiducial Recognition
      • OCR
      • Defect Analysis and Characterization
      • Flatness Analysis
      Software Requirements & Features
      • Standard 300 mm & 200 mm SEMI Compliant Libraries
      • Interfacing Protocols to Host Controller in Standard EFEM
      • SMEMA & SECS/GEM Interfaces
      • Data Management and Tracking Capabilities
      • SEMI E95 Compliance for Human Machine Interface (HMI)
      • Wafer Mapping